-40%

Epoxy Staking Compound, Weather Resistant Solvent Free Pass NASA 2116, 2.5 grams

$ 5.27

Availability: 1500 in stock
  • Model: AA-BOND 2116-2
  • Benefits 1: Passes NASA's Outgassing/Low Outgassing
  • Substrates 2: Ceramics, glass to glass, fabrics, metals
  • Country/Region of Manufacture: United States
  • All returns accepted: ReturnsNotAccepted
  • Condition: New
  • Substrates 1: laminates and other composite materials
  • Brand: Atom Adhesives
  • Benefits 2: Solvent free Weather resistant
  • MPN: 2116-2

    Description

    Technical Product Bulletin
    LOW VAPOR PRESSURE EPOXY STAKING COMPOUND
    PRODUCT DESCRIPTION:
    AA-BOND 2116
    is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is
    recommended for critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is
    required for bonding and enhancing the mechanical and structural rigidity of assemblies.
    AA-BOND 2116
    is two-part, solvent-free compound is readily mixed, handled, used, and cured at room temperature, and
    develops strong bonds to most clean, dry material surfaces including metals, glass, ceramics, wood and many plastics.
    AA-BOND 2116
    bonds provide electrical insulation and excellent resistance to weather, galvanic action, petroleum solvents
    and lubricants, gasoline, jet fuels, alcohol, salts, and mild acids and alkalis.
    GENERAL PROPERTIES:
    Appearance
    Milky translucent
    Cure Type
    Room temperature or Heat Cure
    Benefits
    Passes NASA's Outgassing/Low Outgassing
    Solvent free
    Weather resistant
    Mix Ratio by weight
    100:22.5 / Resin:Hardener
    Substrates
    Ceramics, glass to glass, fabrics, metals, laminates and other composite materials
    Operating Temperature
    -60 to 130 °C
    UNCURED PROPERTIES:
    Specific Gravity
    1.25
    Reactive solids contents, %
    100
    Pot Life
    30 minutes
    CURE SCHEDULE:
    4 hours
    @ 65°C
    24 hours
    @ 25°C
    MISC PROPERTIES:
    Volume Resistivity
    6.00e+13 ohm-cm
    Dielectric Constant
    4.5
    Dielectric Strength
    410 kV/mil
    Hardness, Shore D
    88
    GENERAL INFORMATION:
    For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
    HOW TO USE:
    1)
    Carefully clean and dry all surfaces to be bonded.
    2)
    Apply this completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure
    is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
    3)
    Some separation of components is common during shipping and storage. For this reason, it is recommended that the
    contents of the shipping container be thoroughly mixed prior to use.
    4)
    Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming
    cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as
    well as liquid components and should be re-dissolved prior to use for best results.
    AVAILABILITY:
    This epoxy can be supplied in various different packages.
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