-40%

Silver Filled Epoxy Electrically Conductive 1 part Heat Cure, CG2, 5 grams

$ 71.23

Availability: 849 in stock
  • Substrates 1: aluminum, copper, magnesium, steel, bronze
  • Country/Region of Manufacture: United States
  • All returns accepted: ReturnsNotAccepted
  • Benefit 2: EMI & RFI shielding Cold Solder
  • Substrates 3: phenolic and G-10 epoxy glass boards.
  • Model: AA-DUCT CG2-5
  • Benefit 1: High strength Perfect bond. Silver Color
  • Substrates 2: nickel, kovar, ceramic, glass
  • Condition: New
  • Brand: Atom Adhesives
  • MPN: CG2-5

    Description

    Technical Product Bulletin
    Silver Filled Epoxy Heat Dry Electrically Conductive, one Part  5 grams Adhesive
    THIS PRODUCT DOES NOT CURE/HARDEN UNLESS HIGH HEAT IS APPLIED.
    We have some different products that do not require heating. For more information,
    PRODUCT DESCRIPTION:
    AA-DUCT CG2 is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties
    obtained with a pure silver formulation. This concept opens the
    door to a wide range of applications previously prohibited by the much higher cost of Conventional
    silver conductive.
    AA-DUCT CG2 Formulated with Silver coated ceramic power combined with organic binders and solvents to produce electrically conductive paths, films or patterns
    over non-conductive substrates.
    AA-DUCT CG2 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth,
    thermoplastic, paper, wood and
    many others.
    AA-DUCT CG2 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides,
    electronic modules, flat cable, static shielding, connections, and circuitry.
    PHYSICAL PROPERTIES:
    Appearance
    Silver Coated ceramic
    %Silver coated ceramic
    76
    Cure Type
    Heat cure
    Benefits
    High strength
    Perfect bond
    EMI & RFI shielding
    Wave guides
    Substrates
    Excellent choice for the Integrated Circuits, aluminum, copper, magnesium,steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
    Catalyst
    Anhydride
    CURED PROPERTIES:
    Sheet Resistivity
    <0.1 Ω/sqcm
    Lap shear strength
    2000 Lb/in2 (1400 N/cm2)
    Bulk Resistivity
    3x10-5 Ω/cm
    Adhesion Tensile Strength
    1000 N/cm2 (1500 lb/in2)
    Thermal Conductivity
    0.04J/(cm.s. °C) [0.01cal/(cm.s. °C)]
    Specific heat
    0.30J/(g. °C) :[0.07 cal/g. °C]
    Coefficient of Thermal Expansion
    3x10-5 (m/m)/ °C
    Modulus of elasticity
    4x1010 Pa (6x105 lb/in2)
    Poisson’s Ratio
    0.35
    CURE SCHEDULE:
    0.7 hours
    @ 200°C, 392°F
    1.5 hours
    @ 180°C, 356°F
    2.5 hours
    @ 160°C, 320°F
    GENERAL INFORMATION:
    For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
    HOW TO USE:
    1)
    Carefully clean and dry all surfaces to be bonded.
    2)
    Apply AA-DUCT CG2 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
    3)
    Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
    4)
    Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
    AVAILABILITY:
    This epoxy can be supplied in various different packages.
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